Thin Wafer Processing & Dicing Equipment Market, By Product Type (Thinning Equipment, and Dicing Equipment (Blade Dicing, Laser Dicing, Stealth Dicing, Plasma Dicing)), By Wafer Size, By Wafer Thickness, By Application, By End User, By Country, and By Region Global Industry Analysis, Market Size, Market Share & Forecast from 2025-2032
Report Code: AV3572
Industry: Semiconductor and Electronics
Publiced On: 2025-03-18
Pages: 386
Format:
REPORT HIGHLIGHT
Thin Wafer Processing & Dicing Equipment Market size was valued at US$ 785.73 Million in 2024, expanding at a CAGR of 6.8% from 2025 to 2032.
Thin Wafer Processing and Dicing Equipment refers to specialized machinery used in the semiconductor manufacturing industry to handle and cut ultra-thin silicon wafers, which are crucial for advanced applications such as semiconductor packaging, micro-electromechanical systems (MEMS), power devices, and three-dimensional integrated circuits (3D ICs), with the equipment ensuring precise slicing, minimizing damage, and improving yield, thus enabling the production of high-performance semiconductor chips for a wide range of sectors, including consumer electronics, automotive, telecommunications, and industrial fields, and playing a pivotal role in driving the development of smaller, more powerful, and energy-efficient semiconductor devices that are essential to the ongoing advancement of modern technologies, helping meet the increasing demand for miniaturized, high-performance solutions that support innovations in areas like artificial intelligence, IoT, and renewable energy.
Thin Wafer Processing & Dicing Equipment Market- Market Dynamics
Ø Rising demand for miniaturized electronic devices is anticipated to drive the growth of the market
Consumer electronics, including smartphones, wearables, and Internet of Things (IoT) devices, require ultra-thin wafers to achieve superior performance and maximize space efficiency, with the continued trend of miniaturization in semiconductor packaging—driven by innovations such as 3D integrated circuits (ICs), micro-electromechanical systems (MEMS), and advanced sensors—further fueling the demand for thin wafer processing, as evidenced by the significant rise in online sales, where 2022 saw retail sales across 72 category retailers in the Top 1000 surpassing USD 51.3 billion, a notable increase from USD 48.1 billion in 2021, and total online sales for the top 1000 retailers experiencing an approximate growth of USD 3.25 million in 2023, while the expanding automotive electronics market, particularly in electric vehicles (EVs), presents additional growth opportunities for the market; however, the high initial investment costs associated with adopting such technology remain a challenge to broader market expansion.
Thin Wafer Processing & Dicing Equipment Market- Segmentation Analysis:
The Global Thin Wafer Processing & Dicing Equipment Market is segmented based on Product Type, Wafer Size, Wafer Thickness, Application, End User, and Region.
The market is divided into two primary categories of products: Thinning equipment and Dicing equipment. Dicing equipment is a key driver of market growth in semiconductor manufacturing, as it slices wafers into individual dies. This equipment is crucial for processing thin wafers, which are used across various industries, including consumer electronics, automotive, telecommunications, healthcare, aerospace, defense, and industrial sectors, supporting the demand for smaller, more efficient semiconductor devices.
The market is categorized by wafer size into segments of less than 4 inches, 5 inches, 6 inches, 8 inches, and 12 inches. The 12-inch (300mm) wafer segment is driving significant growth, driven by demand in advanced applications like AI, 5G, automotive systems, and IoT devices. These wafers are preferred for their higher yield and cost-effectiveness. Dicing equipment for 12-inch wafers must ensure high precision, reduce defects, and be compatible with both thin and ultra-thin wafers.
The market is divided based on wafer thickness into three categories: 750 micrometers, 120 micrometers, and 50 micrometers. The Thin Wafer Processing & Dicing Equipment market is segmented by end-user industries, including consumer electronics, automotive, telecommunications, healthcare, aerospace and defense, industrial sectors, and more. The selection of processing and dicing technology is determined by wafer thickness and the specific needs of each application, ensuring optimal performance and efficiency for various industries.
The market is categorized by application into several segments, including CMOS image sensors, Memory and Logic (TSV), MEMS devices, Power devices, RFID, and others. CMOS image sensors are the primary driver of market growth, widely used in smartphones, automotive cameras, medical imaging, and surveillance systems. These sensors require advanced thin wafer processing and dicing for high-performance, compact, and energy-efficient solutions. Wafer thickness, typically ranging from 50µm to 200µm, demands precise, stress-free dicing to prevent defects like cracks, chipping, and heat damage.
The market is categorized by end-user into several sectors, including Consumer Electronics, Automotive, Telecommunications, Healthcare, Aerospace & Defense, Industrial, and Others. Thin wafer processing and dicing equipment is essential for producing accurate, defect-free semiconductor components. The rising demand for thinner, more powerful, and energy-efficient chips is driving the adoption of advanced dicing techniques, such as laser and plasma dicing, across multiple industries to meet the evolving needs of high-performance applications.
Thin Wafer Processing & Dicing Equipment Market- Geographical Insights
North America is set to lead market growth, driven by the increasing adoption of advanced semiconductor materials like Silicon Carbide (SiC) and Gallium Nitride (GaN), which are critical for high-performance applications such as 5G, artificial intelligence, autonomous vehicles, and high-power electronics; in 2021, the semiconductor manufacturing industry in the U.S. invested USD 47.4 billion in research and development, with USD 45.5 billion coming from company-funded initiatives, and California alone contributed USD 23.0 billion, making up 51% of the total company-funded R&D, while Europe, the second-largest region for market expansion, benefits from the growing demand for 5G and Internet of Things (IoT) technologies, positioning both regions at the forefront of innovation and technological advancements in the semiconductor sector.
Thin Wafer Processing & Dicing Equipment Market- Competitive Landscape:
The Thin Wafer Processing and Dicing Equipment Market is highly competitive, with key players focusing on technological innovation, precision engineering, and automation to improve wafer processing efficiency, as companies invest heavily in advanced dicing techniques such as laser and plasma dicing to boost yield, reduce defects, and meet the increasing demand for compact and energy-efficient chips, all while striving to reduce processing costs and maintain high precision; moreover, major manufacturers are expanding their product offerings to cater to a wide range of wafer sizes and thicknesses, ensuring flexibility and adaptability to the evolving needs of industries such as consumer electronics, automotive, healthcare, and telecommunications, where the demand for miniaturized, high-performance components continues to rise, ultimately driving further growth and innovation within the market.
Recent Developments:
v On May 15, 2024, DISCO Corporation, a leading manufacturer of semiconductor production equipment, announced the creation of a diamond wafer manufacturing process using the KABRA technique, an ingot slicing method that incorporates laser technology, significantly increasing the diameter of diamond wafers.
v On September 17, 2024, ASMPT is set to unveil the ALSI LASER1205, a multi-beam laser dicing platform that sets new standards for precision and performance. Silicon carbide (SiC), known for its outstanding electrical and thermal properties, plays a vital role in supporting the energy transition.
SCOPE OF THE REPORT
The scope of this report covers the market by its major segments, which include as follows:
GLOBAL THIN WAFER PROCESSING & DICING EQUIPMENT MARKET KEY PLAYERS- DETAILED COMPETITIVE INSIGHTS
Ø Advanced Dicing Technologies
Ø ASMPT
Ø AXUS TECHNOLOGY
Ø Citizen Chiba Precision Co., Ltd.
Ø DISCO Corporation
Ø Dynatex International
Ø EV Group (EVG)
Ø HANMI Semiconductor
Ø Han\'s Laser Technology Co., Ltd.
Ø KLA Corporation
Ø Lam Research Corporation
Ø Loadpoint Ltd.
Ø Modutek Corporation
Ø NeonTech Co., Ltd.
Ø Panasonic Connect Co., Ltd.
Ø Plasma-Therm
Ø SPTS Technologies Ltd.
Ø Suzhou Delphi Laser Co., Ltd.
Ø Synova SA
Ø Tokyo Electron Limited
Ø TOKYO SEIMITSU CO., LTD (Accretech)
Ø Others
GLOBAL THIN WAFER PROCESSING & DICING EQUIPMENT MARKET, BY PRODUCT TYPE- MARKET ANALYSIS, 2019 - 2032
Ø Thinning Equipment
Ø Dicing Equipment
o Blade Dicing
o Laser Dicing
o Stealth Dicing
o Plasma Dicing
GLOBAL THIN WAFER PROCESSING & DICING EQUIPMENT MARKET, BY WAFER SIZE- MARKET ANALYSIS, 2019 - 2032
Ø Less than 4 inches
Ø 5 inches and 6 inches
Ø 8 inch
Ø 12 inch
GLOBAL THIN WAFER PROCESSING & DICING EQUIPMENT MARKET, BY WAFER THICKNESS- MARKET ANALYSIS, 2019 - 2032
Ø 750 Micrometres
Ø 120 Micrometres
Ø 50 Micrometres
GLOBAL THIN WAFER PROCESSING & DICING EQUIPMENT MARKET, BY APPLICATION- MARKET ANALYSIS, 2019 - 2032
Ø CMOS Image Sensors
Ø Memory and Logic (TSV)
Ø MEMS Device
Ø Power Device
Ø RFID
Ø Others
GLOBAL THIN WAFER PROCESSING & DICING EQUIPMENT MARKET, BY END USER- MARKET ANALYSIS, 2019 - 2032
Ø Consumer Electronics
Ø Automotive
Ø Telecommunications
Ø Healthcare
Ø Aerospace & Defense
Ø Industrial
Ø Others
GLOBAL THIN WAFER PROCESSING & DICING EQUIPMENT MARKET, BY REGION- MARKET ANALYSIS, 2019 - 2032
North America
- U.S.
- Canada
Europe
- Germany
- UK
- France
- Italy
- Spain
- The Netherlands
- Sweden
- Russia
- Poland
- Rest of Europe
Asia Pacific
- China
- India
- Japan
- South Korea
- Australia
- Indonesia
- Thailand
- Philippines
- Rest of APAC
Latin America
- Brazil
- Mexico
- Argentina
- Colombia
- Rest of LATAM
The Middle East and Africa
- Saudi Arabia
- UAE
- Israel
- Turkey
- Algeria
- Egypt
- Rest of MEA
TABLE OF CONTENT
1. Thin Wafer Processing & Dicing Equipment Market Overview
1.1. Study Scope
1.2. Market Estimation Years
2. Executive Summary
2.1. Market Snippet
2.1.1. Thin Wafer Processing & Dicing Equipment Market Snippet by Product Type
2.1.2. Thin Wafer Processing & Dicing Equipment Market Snippet by Wafer Size
2.1.3. Thin Wafer Processing & Dicing Equipment Market Snippet by Wafer Thickness
2.1.4. Thin Wafer Processing & Dicing Equipment Market Snippet by Application
2.1.5. Thin Wafer Processing & Dicing Equipment Market Snippet by End User
2.1.6. Thin Wafer Processing & Dicing Equipment Market Snippet by Country
2.1.7. Thin Wafer Processing & Dicing Equipment Market Snippet by Region
2.2. Competitive Insights
3. Thin Wafer Processing & Dicing Equipment Key Market Trends
3.1. Thin Wafer Processing & Dicing Equipment Market Drivers
3.1.1. Impact Analysis of Market Drivers
3.2. Thin Wafer Processing & Dicing Equipment Market Restraints
3.2.1. Impact Analysis of Market Restraints
3.3. Thin Wafer Processing & Dicing Equipment Market Opportunities
3.4. Thin Wafer Processing & Dicing Equipment Market Future Trends
4. Thin Wafer Processing & Dicing Equipment Industry Study
4.1. PEST Analysis
4.2. Porter’s Five Forces Analysis
4.3. Growth Prospect Mapping
4.4. Regulatory Framework Analysis
5. Thin Wafer Processing & Dicing Equipment Market: Impact of Escalating Geopolitical Tensions
5.1. Impact of COVID-19 Pandemic
5.2. Impact of Russia-Ukraine War
5.3. Impact of Middle East Conflicts
6. Thin Wafer Processing & Dicing Equipment Market Landscape
6.1. Thin Wafer Processing & Dicing Equipment Market Share Analysis, 2024
6.2. Breakdown Data, by Key Manufacturer
6.2.1. Established Players’ Analysis
6.2.2. Emerging Players’ Analysis
7. Thin Wafer Processing & Dicing Equipment Market – By Product Type
7.1. Overview
7.1.1. Segment Share Analysis, By Product Type, 2024 & 2032 (%)
7.1.2. Thinning Equipment
7.1.3. Dicing Equipment
7.1.3.1. Blade Dicing
7.1.3.2. Laser Dicing
7.1.3.3. Stealth Dicing
7.1.3.4. Plasma Dicing
8. Thin Wafer Processing & Dicing Equipment Market – By Wafer Size
8.1. Overview
8.1.1. Segment Share Analysis, By Wafer Size, 2024 & 2032 (%)
8.1.2. Less than 4 Inches
8.1.3. 5 Inches and 6 Inches
8.1.4. 8 Inch
8.1.5. 12 Inch
9. Thin Wafer Processing & Dicing Equipment Market – By Wafer Thickness
9.1. Overview
9.1.1. Segment Share Analysis, By Wafer Thickness, 2024 & 2032 (%)
9.1.2. 750 Micrometres
9.1.3. 120 Micrometres
9.1.4. 50 Micrometres
10. Thin Wafer Processing & Dicing Equipment Market – By Application
10.1. Overview
10.1.1. Segment Share Analysis, By Application, 2024 & 2032 (%)
10.1.2. CMOS Image Sensors
10.1.3. Memory and Logic (TSV)
10.1.4. MEMS Device
10.1.5. Power Device
10.1.6. RFID
10.1.7. Others
11. Thin Wafer Processing & Dicing Equipment Market – By End User
11.1. Overview
11.1.1. Segment Share Analysis, By End User, 2024 & 2032 (%)
11.1.2. Consumer Electronics
11.1.3. Automotive
11.1.4. Telecommunications
11.1.5. Healthcare
11.1.6. Aerospace & Defense
11.1.7. Industrial
11.1.8. Others
12. Thin Wafer Processing & Dicing Equipment Market– By Geography
12.1. Introduction
12.1.1. Segment Share Analysis, By Geography, 2024 & 2032 (%)
12.2. North America
12.2.1. Overview
12.2.2. Thin Wafer Processing & Dicing Equipment Key Manufacturers in North America
12.2.3. North America Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
12.2.4. North America Market Size and Forecast, By Product Type, 2019 - 2032 (US$ Million)
12.2.5. North America Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
12.2.6. North America Market Size and Forecast, By Wafer Thickness, 2019 - 2032 (US$ Million)
12.2.7. North America Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
12.2.8. North America Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
12.2.9. U.S.
12.2.9.1. Overview
12.2.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
12.2.9.3. U.S. Market Size and Forecast, By Product Type, 2019 - 2032 (US$ Million)
12.2.9.4. U.S. Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
12.2.9.5. U.S. Market Size and Forecast, By Wafer Thickness, 2019 - 2032 (US$ Million)
12.2.9.6. U.S. Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
12.2.9.7. U.S. Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
12.2.10. Canada
12.2.10.1. Overview
12.2.10.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
12.2.10.3. Canada Market Size and Forecast, By Product Type, 2019 - 2032 (US$ Million)
12.2.10.4. Canada Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
12.2.10.5. Canada Market Size and Forecast, By Wafer Thickness, 2019 - 2032 (US$ Million)
12.2.10.6. Canada Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
12.2.10.7. Canada Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
12.3. Europe
12.3.1. Overview
12.3.2. Thin Wafer Processing & Dicing Equipment Key Manufacturers in Europe
12.3.3. Europe Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
12.3.4. Europe Market Size and Forecast, By Product Type, 2019 - 2032 (US$ Million)
12.3.5. Europe Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
12.3.6. Europe Market Size and Forecast, By Wafer Thickness, 2019 - 2032 (US$ Million)
12.3.7. Europe Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
12.3.8. Europe Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
12.3.9. Germany
12.3.9.1. Overview
12.3.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
12.3.9.3. Germany Market Size and Forecast, By Product Type, 2019 - 2032 (US$ Million)
12.3.9.4. Germany Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
12.3.9.5. Germany Market Size and Forecast, By Wafer Thickness, 2019 - 2032 (US$ Million)
12.3.9.6. Germany Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
12.3.9.7. Germany Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
12.3.10. UK
12.3.10.1. Overview
12.3.10.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
12.3.10.3. UK Market Size and Forecast, By Product Type, 2019 - 2032 (US$ Million)
12.3.10.4. UK Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
12.3.10.5. UK Market Size and Forecast, By Wafer Thickness, 2019 - 2032 (US$ Million)
12.3.10.6. UK Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
12.3.10.7. UK Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
12.3.11. France
12.3.11.1. Overview
12.3.11.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
12.3.11.3. France Market Size and Forecast, By Product Type, 2019 - 2032 (US$ Million)
12.3.11.4. France Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
12.3.11.5. France Market Size and Forecast, By Wafer Thickness, 2019 - 2032 (US$ Million)
12.3.11.6. France Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
12.3.11.7. France Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
12.3.12. Italy
12.3.12.1. Overview
12.3.12.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
12.3.12.3. Italy Market Size and Forecast, By Product Type, 2019 - 2032 (US$ Million)
12.3.12.4. Italy Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
12.3.12.5. Italy Market Size and Forecast, By Wafer Thickness, 2019 - 2032 (US$ Million)
12.3.12.6. Italy Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
12.3.12.7. Italy Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
12.3.13. Spain
12.3.13.1. Overview
12.3.13.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
12.3.13.3. Spain Market Size and Forecast, By Product Type, 2019 - 2032 (US$ Million)
12.3.13.4. Spain Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
12.3.13.5. Spain Market Size and Forecast, By Wafer Thickness, 2019 - 2032 (US$ Million)
12.3.13.6. Spain Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
12.3.13.7. Spain Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
12.3.14. The Netherlands
12.3.14.1. Overview
12.3.14.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
12.3.14.3. The Netherlands Market Size and Forecast, By Product Type, 2019 - 2032 (US$ Million)
12.3.14.4. The Netherlands Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
12.3.14.5. The Netherlands Market Size and Forecast, By Wafer Thickness, 2019 - 2032 (US$ Million)
12.3.14.6. The Netherlands Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
12.3.14.7. The Netherlands Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
12.3.15. Sweden
12.3.15.1. Overview
12.3.15.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
12.3.15.3. Sweden Market Size and Forecast, By Product Type, 2019 - 2032 (US$ Million)
12.3.15.4. Sweden Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
12.3.15.5. Sweden Market Size and Forecast, By Wafer Thickness, 2019 - 2032 (US$ Million)
12.3.15.6. Sweden Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
12.3.15.7. Sweden Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
12.3.16. Russia
12.3.16.1. Overview
12.3.16.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
12.3.16.3. Russia Market Size and Forecast, By Product Type, 2019 - 2032 (US$ Million)
12.3.16.4. Russia Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
12.3.16.5. Russia Market Size and Forecast, By Wafer Thickness, 2019 - 2032 (US$ Million)
12.3.16.6. Russia Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
12.3.16.7. Russia Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
12.3.17. Poland
12.3.17.1. Overview
12.3.17.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
12.3.17.3. Poland Market Size and Forecast, By Product Type, 2019 - 2032 (US$ Million)
12.3.17.4. Poland Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
12.3.17.5. Poland Market Size and Forecast, By Wafer Thickness, 2019 - 2032 (US$ Million)
12.3.17.6. Poland Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
12.3.17.7. Poland Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
12.3.18. Rest of Europe
12.3.18.1. Overview
12.3.18.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
12.3.18.3. Rest of the Europe Market Size and Forecast, By Product Type, 2019 - 2032 (US$ Million)
12.3.18.4. Rest of the Europe Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
12.3.18.5. Rest of the Europe Market Size and Forecast, By Wafer Thickness, 2019 - 2032 (US$ Million)
12.3.18.6. Rest of the Europe Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
12.3.18.7. Rest of the Europe Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
12.4. Asia Pacific (APAC)
12.4.1. Overview
12.4.2. Thin Wafer Processing & Dicing Equipment Key Manufacturers in Asia Pacific
12.4.3. APAC Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
12.4.4. APAC Market Size and Forecast, By Product Type, 2019 - 2032 (US$ Million)
12.4.5. APAC Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
12.4.6. APAC Market Size and Forecast, By Wafer Thickness, 2019 - 2032 (US$ Million)
12.4.7. APAC Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
12.4.8. APAC Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
12.4.9. China
12.4.9.1. Overview
12.4.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
12.4.9.3. China Market Size and Forecast, By Product Type, 2019 - 2032 (US$ Million)
12.4.9.4. China Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
12.4.9.5. China Market Size and Forecast, By Wafer Thickness, 2019 - 2032 (US$ Million)
12.4.9.6. China Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
12.4.9.7. China Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
12.4.10. India
12.4.10.1. Overview
12.4.10.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
12.4.10.3. India Market Size and Forecast, By Product Type, 2019 - 2032 (US$ Million)
12.4.10.4. India Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
12.4.10.5. India Market Size and Forecast, By Wafer Thickness, 2019 - 2032 (US$ Million)
12.4.10.6. India Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
12.4.10.7. India Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
12.4.11. Japan
12.4.11.1. Overview
12.4.11.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
12.4.11.3. Japan Market Size and Forecast, By Product Type, 2019 - 2032 (US$ Million)
12.4.11.4. Japan Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
12.4.11.5. Japan Market Size and Forecast, By Wafer Thickness, 2019 - 2032 (US$ Million)
12.4.11.6. Japan Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
12.4.11.7. Japan Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
12.4.12. South Korea
12.4.12.1. Overview
12.4.12.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
12.4.12.3. South Korea Market Size and Forecast, By Product Type, 2019 - 2032 (US$ Million)
12.4.12.4. South Korea Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
12.4.12.5. South Korea Market Size and Forecast, By Wafer Thickness, 2019 - 2032 (US$ Million)
12.4.12.6. South Korea Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
12.4.12.7. South Korea Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
12.4.13. Australia
12.4.13.1. Overview
12.4.13.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
12.4.13.3. Australia Market Size and Forecast, By Product Type, 2019 - 2032 (US$ Million)
12.4.13.4. Australia Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
12.4.13.5. Australia Market Size and Forecast, By Wafer Thickness, 2019 - 2032 (US$ Million)
12.4.13.6. Australia Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
12.4.13.7. Australia Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
12.4.14. Indonesia
12.4.14.1. Overview
12.4.14.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
12.4.14.3. Indonesia Market Size and Forecast, By Product Type, 2019 - 2032 (US$ Million)
12.4.14.4. Indonesia Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
12.4.14.5. Indonesia Market Size and Forecast, By Wafer Thickness, 2019 - 2032 (US$ Million)
12.4.14.6. Indonesia Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
12.4.14.7. Indonesia Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
12.4.15. Thailand
12.4.15.1. Overview
12.4.15.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
12.4.15.3. Thailand Market Size and Forecast, By Product Type, 2019 - 2032 (US$ Million)
12.4.15.4. Thailand Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
12.4.15.5. Thailand Market Size and Forecast, By Wafer Thickness, 2019 - 2032 (US$ Million)
12.4.15.6. Thailand Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
12.4.15.7. Thailand Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
12.4.16. Philippines
12.4.16.1. Overview
12.4.16.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
12.4.16.3. Philippines Market Size and Forecast, By Product Type, 2019 - 2032 (US$ Million)
12.4.16.4. Philippines Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
12.4.16.5. Philippines Market Size and Forecast, By Wafer Thickness, 2019 - 2032 (US$ Million)
12.4.16.6. Philippines Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
12.4.16.7. Philippines Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
12.4.17. Rest of APAC
12.4.17.1. Overview
12.4.17.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
12.4.17.3. Rest of APAC Market Size and Forecast, By Product Type, 2019 - 2032 (US$ Million)
12.4.17.4. Rest of APAC Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
12.4.17.5. Rest of APAC Market Size and Forecast, By Wafer Thickness, 2019 - 2032 (US$ Million)
12.4.17.6. Rest of APAC Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
12.4.17.7. Rest of APAC Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
12.5. Latin America (LATAM)
12.5.1. Overview
12.5.2. Thin Wafer Processing & Dicing Equipment Key Manufacturers in Latin America
12.5.3. LATAM Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
12.5.4. LATAM Market Size and Forecast, By Product Type, 2019 - 2032 (US$ Million)
12.5.5. LATAM Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
12.5.6. LATAM Market Size and Forecast, By Wafer Thickness, 2019 - 2032 (US$ Million)
12.5.7. LATAM Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
12.5.8. LATAM Size and Forecast, By End User, 2019 - 2032 (US$ Million)
12.5.9. Brazil
12.5.9.1. Overview
12.5.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
12.5.9.3. Brazil Market Size and Forecast, By Product Type, 2019 - 2032 (US$ Million)
12.5.9.4. Brazil Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
12.5.9.5. Brazil Market Size and Forecast, By Wafer Thickness, 2019 - 2032 (US$ Million)
12.5.9.6. Brazil Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
12.5.9.7. Brazil Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
12.5.10. Mexico
12.5.10.1. Overview
12.5.10.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
12.5.10.3. Mexico Market Size and Forecast, By Product Type, 2019 - 2032 (US$ Million)
12.5.10.4. Mexico Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
12.5.10.5. Mexico Market Size and Forecast, By Wafer Thickness, 2019 - 2032 (US$ Million)
12.5.10.6. Mexico Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
12.5.10.7. Mexico Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
12.5.11. Argentina
12.5.11.1. Overview
12.5.11.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
12.5.11.3. Argentina Market Size and Forecast, By Product Type, 2019 - 2032 (US$ Million)
12.5.11.4. Argentina Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
12.5.11.5. Argentina Market Size and Forecast, By Wafer Thickness, 2019 - 2032 (US$ Million)
12.5.11.6. Argentina Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
12.5.11.7. Argentina Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
12.5.12. Colombia
12.5.12.1. Overview
12.5.12.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
12.5.12.3. Colombia Market Size and Forecast, By Product Type, 2019 - 2032 (US$ Million)
12.5.12.4. Colombia Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
12.5.12.5. Colombia Market Size and Forecast, By Wafer Thickness, 2019 - 2032 (US$ Million)
12.5.12.6. Colombia Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
12.5.12.7. Colombia Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
12.5.13. Rest of LATAM
12.5.13.1. Overview
12.5.13.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
12.5.13.3. Rest of LATAM Market Size and Forecast, By Product Type, 2019 - 2032 (US$ Million)
12.5.13.4. Rest of LATAM Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
12.5.13.5. Rest of LATAM Market Size and Forecast, By Wafer Thickness, 2019 - 2032 (US$ Million)
12.5.13.6. Rest of LATAM Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
12.5.13.7. Rest of LATAM Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
12.6. Middle East and Africa
12.6.1. Overview
12.6.2. Thin Wafer Processing & Dicing Equipment Key Manufacturers in Middle East and Africa
12.6.3. Middle East and Africa Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
12.6.4. Middle East and Africa Market Size and Forecast, By Product Type, 2019 - 2032 (US$ Million)
12.6.5. Middle East and Africa Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
12.6.6. Middle East and Africa Market Size and Forecast, By Wafer Thickness, 2019 - 2032 (US$ Million)
12.6.7. Middle East and Africa Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
12.6.8. Middle East and Africa Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
12.6.9. Saudi Arabia
12.6.9.1. Overview
12.6.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
12.6.9.3. Saudi Arabia Market Size and Forecast, By Product Type, 2019 - 2032 (US$ Million)
12.6.9.4. Saudi Arabia Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
12.6.9.5. Saudi Arabia Market Size and Forecast, By Wafer Thickness, 2019 - 2032 (US$ Million)
12.6.9.6. Saudi Arabia Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
12.6.9.7. Saudi Arabia Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
12.6.10. United Arab Emirates
12.6.10.1. Overview
12.6.10.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
12.6.10.3. United Arab Emirates Market Size and Forecast, By Product Type, 2019 - 2032 (US$ Million)
12.6.10.4. United Arab Emirates Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
12.6.10.5. United Arab Emirates Market Size and Forecast, By Wafer Thickness, 2019 - 2032 (US$ Million)
12.6.10.6. United Arab Emirates Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
12.6.10.7. United Arab Emirates Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
12.6.11. Israel
12.6.11.1. Overview
12.6.11.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
12.6.11.3. Israel Market Size and Forecast, By Product Type, 2019 - 2032 (US$ Million)
12.6.11.4. Israel Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
12.6.11.5. Israel Market Size and Forecast, By Wafer Thickness, 2019 - 2032 (US$ Million)
12.6.11.6. Israel Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
12.6.11.7. Israel Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
12.6.12. Turkey
12.6.12.1. Overview
12.6.12.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
12.6.12.3. Turkey Market Size and Forecast, By Product Type, 2019 - 2032 (US$ Million)
12.6.12.4. Turkey Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
12.6.12.5. Turkey Market Size and Forecast, By Wafer Thickness, 2019 - 2032 (US$ Million)
12.6.12.6. Turkey Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
12.6.12.7. Turkey Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
12.6.13. Algeria
12.6.13.1. Overview
12.6.13.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
12.6.13.3. Algeria Market Size and Forecast, By Product Type, 2019 - 2032 (US$ Million)
12.6.13.4. Algeria Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
12.6.13.5. Algeria Market Size and Forecast, By Wafer Thickness, 2019 - 2032 (US$ Million)
12.6.13.6. Algeria Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
12.6.13.7. Algeria Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
12.6.14. Egypt
12.6.14.1. Overview
12.6.14.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
12.6.14.3. Egypt Market Size and Forecast, By Product Type, 2019 - 2032 (US$ Million)
12.6.14.4. Egypt Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
12.6.14.5. Egypt Market Size and Forecast, By Wafer Thickness, 2019 - 2032 (US$ Million)
12.6.14.6. Egypt Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
12.6.14.7. Egypt Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
12.6.15. Rest of MEA
12.6.15.1. Overview
12.6.15.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
12.6.15.3. Rest of MEA Market Size and Forecast, By Product Type, 2019 - 2032 (US$ Million)
12.6.15.4. Rest of MEA Market Size and Forecast, By Wafer Size, 2019 - 2032 (US$ Million)
12.6.15.5. Rest of MEA Market Size and Forecast, By Wafer Thickness, 2019 - 2032 (US$ Million)
12.6.15.6. Rest of MEA Market Size and Forecast, By Application, 2019 - 2032 (US$ Million)
12.6.15.7. Rest of MEA Market Size and Forecast, By End User, 2019 - 2032 (US$ Million)
13. Key Vendor Analysis- Thin Wafer Processing & Dicing Equipment Industry
13.1. Competitive Dashboard
13.1.1. Competitive Benchmarking
13.1.2. Competitive Positioning
13.2. Company Profiles
13.2.1. Advanced Dicing Technologies
13.2.2. ASMPT
13.2.3. AXUS TECHNOLOGY
13.2.4. Citizen Chiba Precision Co., Ltd.
13.2.5. DISCO Corporation
13.2.6. Dynatex International
13.2.7. EV Group (EVG)
13.2.8. HANMI Semiconductor
13.2.9. Han\'s Laser Technology Co., Ltd.
13.2.10. KLA Corporation
13.2.11. Lam Research Corporation
13.2.12. Loadpoint Ltd.
13.2.13. Modutek Corporation
13.2.14. NeonTech Co.,Ltd.
13.2.15. Panasonic Connect Co., Ltd.
13.2.16. Plasma-Therm
13.2.17. SPTS Technologies Ltd.
13.2.18. Suzhou Delphi Laser Co., Ltd.
13.2.19. Synova SA
13.2.20. Tokyo Electron Limited
13.2.21. TOKYO SEIMITSU CO., LTD (Accretech)
13.2.22. Others
14. 360 Degree Analyst View
15. Appendix
15.1. Research Methodology
15.2. References
15.3. Abbreviations
15.4. Disclaimer
15.5. Contact Us
